• DocumentCode
    1808489
  • Title

    A hybrid GaN/organic X-band transmitter module

  • Author

    Pavlidis, Spyridon ; Donado Morcillo, Carlos A. ; Song, Peter ; Khan, Wasif T. ; Fitch, R. ; Gillespie, J. ; Febo, R. ; Quach, T. ; Papapolyrnerou, J.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2013
  • fDate
    21-23 Jan. 2013
  • Firstpage
    141
  • Lastpage
    143
  • Abstract
    The design and implementation of a compact, flexible and lightweight X-band transmitter (Tx) module based on high-power gallium nitride (GaN) transistor technology and a low-cost organic package made from liquid crystal polymer (LCP) is presented. In-package measurements of the power amplifier (PA) at 8 GHz show a P.A.E.max of >31%, P1dB of 20 dBm and gain of 11.42 dB. A 4×1 patch antenna array was also fabricated on the same platform. Though no thermal management was used, an effective isotropically radiated power (EIRP) in excess of 20 dBm at 10 GHz was measured for the transmitter module, consisting of only a single-stage PA and antenna array, thus demonstrating that even greater performance can be achieved in the future.
  • Keywords
    antenna arrays; gallium compounds; power amplifiers; radio transmitters; thermal management (packaging); transistors; wide band gap semiconductors; EIRP; GaN; In-package measurements; LCP; PA; effective isotropically radiated power; flexible X-band transmitter module; frequency 10 GHz; gain 11.42 dB; hybrid organic X-band transmitter module; lightweight X-band transmitter module; liquid crystal polymer; low-cost organic package made; patch antenna array; power amplifier; single-stage PA; thermal management; transistor technology; Antenna measurements; Arrays; Gain; Gallium nitride; HEMTs; Power measurement; Transmitters; Gallium nitride; antenna arrays; organic materials; power amplifier; x-band;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2013 IEEE 13th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4673-1552-4
  • Electronic_ISBN
    978-1-4673-1551-7
  • Type

    conf

  • DOI
    10.1109/SiRF.2013.6489459
  • Filename
    6489459