• DocumentCode
    1809308
  • Title

    Parameters design for modular multilevel converter (MMC)

  • Author

    Cunico, Lucas M. ; Lambert, G. ; Dacol, Rodrigo P. ; Vidal Garcia Oliveira, Sergio ; De Novaes, Yales Romulo

  • Author_Institution
    UDESC - State Univ. of Santa Catarina, Florianópolis, Brazil
  • fYear
    2013
  • fDate
    27-31 Oct. 2013
  • Firstpage
    264
  • Lastpage
    270
  • Abstract
    The modular multilevel converter is one of the most interesting transformerless multilevel converter topology intended for medium and high-voltage power conversion. Thus, as a new topology, a fewer design guidelines are presented in the literature, on the other hand there are many restrictions. This paper presents aims to be a design guide lines to project a MMC system. The minimum submodule capacitor requirement is presented as the capacitance related to the load displacement angle, operating frequency and output power. The arm inductor design include three parameters: current ripple, fault condition and circulating current. Semiconductor current stress are calculated using average quasi-instantaneous values and rms quasi-instantaneous values will be used. From the performed analysis some normalized abacus are derived and can be used as start point for a new MMC design. The results were validated using MATLAB simulation. Furthermore, experimental results based on 2.2 kW, 5 kHz switching frequency prototype are also include and analyzed.
  • Keywords
    power capacitors; power convertors; power inductors; MATLAB simulation; MMC system; arm inductor design; average quasiinstantaneous value; circulating current; current ripple; fault condition; frequency 5 kHz; high-voltage power conversion; load displacement angle; medium-voltage power conversion; minimum submodule capacitor requirement; modular multilevel converter system; power 2.2 kW; rms quasiinstantaneous value; semiconductor current stress; switching frequency prototype; transformerless multilevel converter topology; Capacitance; Capacitors; Equations; Inductors; Mathematical model; Stress; Topology; MMC; modular multilevel converter; power converter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (COBEP), 2013 Brazilian
  • Conference_Location
    Gramado
  • ISSN
    2175-8603
  • Type

    conf

  • DOI
    10.1109/COBEP.2013.6785126
  • Filename
    6785126