• DocumentCode
    181271
  • Title

    Comparison of critical current filaments in IGBT short circuit and during diode turn-off

  • Author

    Baburske, R. ; van Treek, Vera ; Pfirsch, F. ; Niedernostheide, F.-J. ; Jaeger, Christian ; Schulze, H.-J. ; Felsl, Hans Peter

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    47
  • Lastpage
    50
  • Abstract
    Device simulations of two-dimensional structures with a huge lateral extension indicate that the combination of lateral current flow and a vertical reduction of space-charge region are necessary for the filament formation during the short-circuit operation of IGBTs and the turn-off of diodes. The shape of the electric-field distribution is introduced as new criterion to estimate the rising branch of the short-circuit destruction curve in the Ic-Vce SOA-diagram. The impact of the stray inductance Lstray and the gate resistor RG on the short-circuit destruction limit are experimentally investigated. The presented results allow a deeper understanding of the different electrical short-circuit failure mechanisms (turn-on, quasi-stationary state, turn-off) and their relation to one another.
  • Keywords
    insulated gate bipolar transistors; power semiconductor devices; semiconductor device breakdown; semiconductor device reliability; space charge; IGBT short circuit; critical current filaments; diode turn-off; electric field distribution; electrical short-circuit failure mechanisms; lateral current flow; lateral extension; short circuit destruction curve; short circuit destruction limit; space-charge region; stray inductance; two-dimensional structure; Clamps; Current density; Insulated gate bipolar transistors; Logic gates; Plasmas; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6855972
  • Filename
    6855972