Title :
High reliable and thermally conductive stack for high-power module in HEV
Author :
Ibukiyama, Masahiro ; Monden, Kenji ; Nonogaki, Ryozo
Author_Institution :
Res. Centre, Denki Kagaku Kogyo KK, Tokyo, Japan
Abstract :
The high-power module generates considerable heat, and its power density and life are restricted by temperature-rise. The presented integrated stack is suitable for high-power modules in a hybrid electric vehicles (HEV). It consists of Al circuits, AlN ceramic plates and Al-SiC composite plates. As the stack does not include a solder layer between a ceramic substrate and base-plate, the stack decreases the amount of lead (Pb) in the power module. Furthermore the elimination of solder brings not only lower thermal resistance but also high reliability because of elimination of solder crack. We are confident that the stacks are most suitable for high-power modules in HEV
Keywords :
aluminium; aluminium compounds; automotive electronics; ceramics; electric vehicles; modules; reliability; silicon compounds; thermal conductivity; thermal resistance; Al; Al circuits; Al-SiC; Al-SiC composite plates; AlN; AlN ceramic plates; HEV; Pb; electric power control unit; high reliability; high-power module; hybrid electric vehicles; thermal resistance; thermally conductive stack; Artificial intelligence; Ceramics; Circuits; Copper; Costs; Hybrid electric vehicles; Lead; Multichip modules; Thermal conductivity; Thermal resistance;
Conference_Titel :
Vehicle Electronics Conference, 2001. IVEC 2001. Proceedings of the IEEE International
Conference_Location :
Tottori
Print_ISBN :
0-7803-7229-8
DOI :
10.1109/IVEC.2001.961717
