• DocumentCode
    1814432
  • Title

    SOI-based devices and technologies for High Voltage ICs

  • Author

    Udrea, Florin

  • Author_Institution
    Univ. of Cambridge, Cambridge
  • fYear
    2007
  • fDate
    Sept. 30 2007-Oct. 2 2007
  • Firstpage
    74
  • Lastpage
    81
  • Abstract
    This paper reviews the current status Silicon-On-Insulator (SOI) devices and technologies for high voltage integrated circuits (HVICs) and discusses new trends in the field. The paper focuses on novel SOI-based RESURF concepts such as superjunction, linearly graded profile or SOI membrane technology. Due to its intrinsic isolation properties, the SOI is the ideal substrate for bipolar MOS switches such as the LIGBT. In fact, the only LIGBT products on the market are fabricated using Dielectric Isolation (type of SOI) and SOI technology. The paper finishes with an overview of the fierce fight of technology survival in terms of specific Ron vs breakdown voltage. Here the SOI competes with quasi-vertical DMOS technologies and advanced bulk BCD technologies.
  • Keywords
    bipolar integrated circuits; insulated gate bipolar transistors; power integrated circuits; power semiconductor switches; silicon-on-insulator; LDMOSFET; LIGBT; RESURF concepts; SOI-based devices; advanced bulk BCD technologies; bipolar MOS switches; dielectric isolation; high voltage IC; high voltage integrated circuits; intrinsic isolation properties; power IC; quasivertical DMOS technologies; silicon-on-insulator devices; specific Ron; CMOS technology; Dielectric substrates; Integrated circuit technology; Isolation technology; Leakage current; Power integrated circuits; Silicon on insulator technology; Temperature; Ultra large scale integration; Voltage; High Voltage Integrated Circuits; LDMOSFET; LIGBT; Power ICs; SOI technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting, 2007. BCTM '07. IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4244-1019-4
  • Electronic_ISBN
    1088-9299
  • Type

    conf

  • DOI
    10.1109/BIPOL.2007.4351842
  • Filename
    4351842