• DocumentCode
    1815147
  • Title

    Effects of tissue microstructure on ultrasonic heating with interstitial applicator

  • Author

    Jarosz, Boguslaw J. ; Werner, Martin

  • Author_Institution
    Dept. of Phys., Carleton Univ., Ottawa, Ont., Canada
  • fYear
    1994
  • fDate
    3-6 Nov 1994
  • Firstpage
    674
  • Abstract
    Calculated heating rates achieved with an interstitial ultrasonic applicator have been observed to differ significantly with the rates observed in porcine brain. One of the reasons for the discrepancy could have been treatment of the tissue as a homogenous medium, neglecting a microstructure of the tissue. The role of the microstructure is discussed in this presentation. The applicator consisting of a piezoelectric transducer driven in cw mode at about 1.0 MHz attached to a waveguide in the form of G18 spinal needle supplied ultrasound energy into about 288 cm3 samples of normal in vitro and emulsified porcine brain. Hyperthermia of 9-15 K observed in the two types of samples resulted In significantly different heating rates and plateau of temperature. Results of measurements compared with theoretical estimates gave better agreement for emulsified tissue
  • Keywords
    biological effects of acoustic radiation; biomedical ultrasonics; brain; hyperthermia; piezoelectric transducers; ultrasonic transducers; 1.0 MHz; cw mode; emulsified tissue; heating rates; hyperthermia; interstitial applicator; normal in vitro porcine brain; piezoelectric transducer; porcine brain; spinal needle; tissue microstructure; ultrasonic heating; ultrasound energy; waveguide; Applicators; Heating; Hyperthermia; In vitro; Microstructure; Needles; Piezoelectric transducers; Temperature measurement; Ultrasonic imaging; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2050-6
  • Type

    conf

  • DOI
    10.1109/IEMBS.1994.411856
  • Filename
    411856