• DocumentCode
    1817953
  • Title

    Vacuum-encapsulated thermistor bolometer type miniature infrared sensor

  • Author

    Mori, Takehisa ; Kudoh, Takeshi ; Komatsu, Kiyoshi ; Kimura, Mitsuteru

  • Author_Institution
    R&D Center, Terumo Corp., Kanagawa, Japan
  • fYear
    1994
  • fDate
    1994
  • Firstpage
    257
  • Lastpage
    262
  • Abstract
    Clinical tympanic thermometers detecting infrared radiation from the tympanic membrane of the ear have been used in the field of medical care. Because of the weakness of the infrared radiation, infrared sensors for clinical thermometers need high sensitivity, good resolution and small size. Therefore, we have developed a vacuum-encapsulated thermistor bolometer type infrared sensor for this purpose using semiconductor micromachining techniques. The sensor has a heat-sensitive portion on the micro-air-bridge designed to minimize heat capacity. To decrease the heat loss to the ambient air, the micro-air-bridge is encapsulated in a vacuum micro-chamber. Two thermistors on the individual micro-air-bridge are contained in the same micro-chamber. In order to cancel the thermally induced background noise, the differential output signal from the two thermistors is monitored. In this work, two types of thermistor were investigated. One was a germanium thin film thermistor (germanium thermistor) and the other a polycrystalline silicon Schottky barrier thermistor. The former has a thermistor constant B of 3500 K to 4300 K while the latter shows a larger equivalent thermistor constant of 5300 K to 6400 K. A hermetically sealed small packaging (2.0 mm×2.5 mm×0.8 mm) could be achieved. These sensors were fabricated through a successive batch process. Furthermore, the whole fabrication process, including the hermetic sealings is essentially compatible with the integrated circuit process. The sensitivity of the germanium thermistor is better than 560 V/W at 5.0 V dc, in spite of absorption loss through the silicon window
  • Keywords
    thermistors; 3500 to 4300 K; 5 V; 5300 to 6400 K; Ge; Si; batch process; clinical thermometers; clinical tympanic thermometers; differential output signal; ear; germanium thin film thermistor; heat capacity; heat-sensitive portion; hermetic sealings; infrared radiation; infrared sensors; integrated circuit process; medical care; micro-air-bridge; micro-chamber; miniature infrared sensor; polycrystalline silicon Schottky barrier thermistor; semiconductor micromachining; thermally induced background noise; tympanic membrane; vacuum-encapsulated thermistor bolometer; Biomembranes; Bolometers; Ear; Germanium; Infrared detectors; Infrared sensors; Radiation detectors; Silicon; Thermistors; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1994, MEMS '94, Proceedings, IEEE Workshop on
  • Conference_Location
    Oiso
  • Print_ISBN
    0-7803-1833-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1994.555766
  • Filename
    555766