• DocumentCode
    18203
  • Title

    Improvement of RF Performance by Using Tunnel Diode Body Contact Structure in PD SOI nMOSFETs

  • Author

    Kai Lu ; Jing Chen ; Jiexin Luo ; Jun Liu ; Qingqing Wu ; Zhan Chai ; Xi Wang

  • Author_Institution
    State Key Lab. of Functional Mater. for Inf., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
  • Volume
    35
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan. 2014
  • Firstpage
    15
  • Lastpage
    17
  • Abstract
    Radio-frequency (RF) performance of multi-finger partially depleted silicon-on-insulator (SoI) nMOSFETs with tunnel diode body contact (TDBC) structure is investigated in this letter. The TDBC structure suppresses floating-body effect and body instability significantly and shows less drain conductance degradation with respect to FB and TB devices. The peak cutoff frequency (fT) and maximum oscillation frequency (fMAX) of TDBC devices are 96.4 and 132.8 GHz, respectively. Due to lower parasitic resistances and capacitances, the device with TDBC structures represents an improvement of 10% for the fT and of 90% for the fMAX compared with conventional T-gate body-contact devices. The investigation results indicate that TDBC SoI MOSFETs are a good candidate for analog and RF applications.
  • Keywords
    MOSFET; silicon-on-insulator; tunnel diodes; FB devices; PD SOI nMOSFET; RF performance; T-gate body-contact devices; TB devices; TDBC structure; analog applications; body instability suppression; floating-body effect suppression; frequency 132.8 GHz; frequency 96.4 GHz; multifinger partially depleted silicon-on-insulator; parasitic capacitances; parasitic resistances; radiofrequency performance; tunnel diode body contact structure; Degradation; Immune system; Logic gates; MOSFET; Performance evaluation; Radio frequency; Silicon-on-insulator; Radio-frequency (RF); body contact; floating body; partially depleted silicon-on-insulator; tunnel diode;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2291878
  • Filename
    6680609