DocumentCode :
1821667
Title :
Effects of ATH particle size on the properties of silicone rubber
Author :
Park, H.Y. ; Kang, D.P. ; Ahn, M.S. ; Kim, D.W. ; Lee, H.B. ; Oh, S.H.
Author_Institution :
Korea Electrotechnol. Res. Inst., Kyeongnam, South Korea
Volume :
2
fYear :
2003
fDate :
1-5 June 2003
Firstpage :
626
Abstract :
ATH is added to the silicone rubber(SIR) for the improvement of its resistance against surface discharge. Hydrophobicity recovery properties and arc resistance of SIR could be different by the content, surface treatment state and particle size of ATH. For material study, ATH with different particle sizes was added during compounding. SIR was deteriorated by a corona treatment. Hydrophobicity recovery rate after corona treatment and arc resistance of silicone samples were investigated. Hydrophobicity recovery rate of SIR were evaluated by the measurement of contact angle. Arc resistance was evaluated by measuring weight loss after arc resistance test. Surface state of SIR after corona treatment was investigated by a scanning electron microscope. It was observed that the hydrophobicity recovery rate and arc resistance were different from particle size of ATH.
Keywords :
arcs (electric); contact angle; corona; dielectric materials; particle size; plasma materials processing; recovery; scanning electron microscopy; silicone rubber; surface resistance; surface states; surface treatment; ATH particle size; arc resistance test; compounding; contact angle; corona treatment; hydrophobicity recovery; scanning electron microscopy; silicone rubber properties; surface discharge; surface state; surface treatment state; weight loss; Corona; Electrical resistance measurement; Goniometers; Loss measurement; Rubber; Surface discharges; Surface resistance; Surface treatment; Testing; Weight measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN :
1081-7735
Print_ISBN :
0-7803-7725-7
Type :
conf
DOI :
10.1109/ICPADM.2003.1218495
Filename :
1218495
Link To Document :
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