• DocumentCode
    1822335
  • Title

    Double vector-integral-equation method for microstrip-lines on photonic band-gap substrates

  • Author

    Yang, H.Y.D.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    8-13 June 1997
  • Firstpage
    191
  • Abstract
    This paper presents a double vector-integral-equation (DOVIE) method for the modeling of integrated circuit components on artificial (photonic band-gap) substrates. The proposed computational method deals with the interaction of circuit components (continuous plane wave spectrum) and artificial materials (discrete plane wave spectrum, Floquet modes). The method of solution involves two stages of vector integral-equations. The first integral equation formulation is to find the Green´s function for a PBG structure. A spectral-domain moment-method is applied to the second vector integral-equation to determine the fields or currents on the circuit components and the associated parameters of interest. Field solutions of microstrip lines on PBG substrates are discussed. The results of this work initiate research for many innovated microwave and millimeter-wave integrated components and devices.
  • Keywords
    Green´s function methods; integral equations; method of moments; microstrip lines; photonic band gap; spectral-domain analysis; transmission line theory; Floquet mode; Green function; artificial material; circuit component model; continuous plane wave spectrum; discrete plane wave spectrum; double vector integral equation; microstrip line; microwave integrated circuit; millimeter-wave integrated circuit; photonic band gap substrate; spectral domain moment method; Crystalline materials; Dielectric materials; Ferroelectric materials; Integral equations; Magnetic materials; Microstrip; Periodic structures; Phased arrays; Photonic band gap; Photonic crystals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1997., IEEE MTT-S International
  • Conference_Location
    Denver, CO, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-3814-6
  • Type

    conf

  • DOI
    10.1109/MWSYM.1997.604553
  • Filename
    604553