• DocumentCode
    1822602
  • Title

    Selective-area deposition of diamond films by combustion activation CVD

  • Author

    Wongprasert, Y. ; Titiroongruang, W.

  • Author_Institution
    Dept. of Electron. Eng., King Mongkut´´s Inst. of Technol., Bangkok, Thailand
  • Volume
    2
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    786
  • Abstract
    This paper was a remarkable point of the new synthesis method that was combustion activation. The synthesized diamond was developed for electronic devices. So it was necessary to determine the area of pattern form of synthesized diamond films. And study on selective deposition of diamond films was presented for leading to develop diamond electronic devices. Surface preparation of silicon substrate that effects to the diamond nucleation, was varied the different conditions. The important parameters of fundamental circuit design were studied by designing patterns of diamond films. For the pattern fabrication, fabrication techniques are used differently such as silicon-dioxide mask technique or Mirror-polished technique in order to protect diamond films generation. The diamond films were analyzed by several techniques. Scanning Electron Microscopy (SEM) was analyzed diamond films growth, grain size and film thickness. Seebeck effect was analyzed type of carrier charge. Raman spectroscopy was analyzed carbon bonding (sp2 or sp3). The properties of diamond films were studied on the high temperature operation. From the experiments were found that the best method for fabricating diamond films patterns are using silicon-dioxide mask technique compared with using mirror-polished Si for synthesized diamond films protection.
  • Keywords
    Raman spectra; Seebeck effect; chemical vapour deposition; combustion; diamond; elemental semiconductors; grain size; nucleation; scanning electron microscopy; semiconductor growth; C; Raman spectroscopy; SEM; Seebeck effect; Si; carbon bonding; carrier charge; combustion activation CVD; diamond films; electronic devices; fundamental circuit design; grain size; mirror-polished Si; mirror-polished technique; nucleation; scanning electron microscopy; selective-area deposition; silicon substrate; silicondioxide mask technique; surface preparation; Circuit synthesis; Combustion; Fabrication; Grain size; Protection; Scanning electron microscopy; Semiconductor films; Silicon; Substrates; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218535
  • Filename
    1218535