Dbc (direct bond copper) substrate with integrated flat heat pipe

Author

Schulz-Harder, Jürgen ; Dezord, Jean Bernard ; Schaeffer, Christian ; Avenas, Yvan ; Puig, Olivier ; Rogg, Alexander ; Exel, Karl ; Utz-Kistner, Andreas

Author_Institution

Curamik Electron. GmbH

fYear

2006

fDate

14-16 March 2006

Firstpage

152

Lastpage

156

Abstract

A novel heat pipe design was developed consisting or a ceramic substrate sandwich with integrated flat heat pipe. On both sides of the heat pipe active electronic components, such as IGBT´s or MOSFET´s, can be mounted on an etched copper circuit. Heat densities over 80 W/cm₂ can be dissipated easily. The functionality is independent of the working position either horizontal or vertical. The heat pipe can be used to an internal pressure over 7 bars without cracking the ceramic substrate. All requirements for space applications could be fulfilled. First application is foreseen for cooling DC-DC converters in satellites

Keywords

ceramic insulation; cooling; copper; electronics packaging; heat pipes; Cu; DBC substrate; IGBT; MOSFET; active electronic component; ceramic substrate; cooling DC-DC converters; direct bond copper substrate; etched copper circuit; integrated flat heat pipe; space satellites; Bars; Bonding; Ceramics; Circuits; Cooling; Copper; DC-DC power converters; Electronic components; Etching; Insulated gate bipolar transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE

Conference_Location

Dallas, TX

Print_ISBN

1-4244-0153-4

Type

conf

DOI

10.1109/STHERM.2006.1625221

Filename

1625221