DocumentCode :
1823395
Title :
High-temperature operation MOS-IGBT power clamp for improved ESD protection in smart power SOI technology
Author :
Arbess, H. ; Trémouilles, D. ; Bafleur, M.
Author_Institution :
LAAS, CNRS, Toulouse, France
fYear :
2011
fDate :
11-16 Sept. 2011
Firstpage :
1
Lastpage :
8
Abstract :
We propose a new MOS-IGBT power clamp for high-temperature operation providing a very compact high-robustness ESD protection with low temperature sensitivity. It is achieved by inserting in the same LDMOS device P+ diffusions in the drain with various N+/P+ ratios whose impact on RON and holding current at high temperatures is thoroughly studied.
Keywords :
MOSFET; electrostatic discharge; high-temperature electronics; insulated gate bipolar transistors; power transistors; silicon-on-insulator; ESD protection; LDMOS device P+ diffusions; MOS-IGBT power clamp; Si; high-temperature operation; low temperature sensitivity; smart power SOI technology; Current measurement; Electrostatic discharge; Insulated gate bipolar transistors; Logic gates; Robustness; Temperature measurement; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location :
Anaheim, CA
ISSN :
Pending
Electronic_ISBN :
Pending
Type :
conf
Filename :
6045568
Link To Document :
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