DocumentCode
1828207
Title
Automated wafer lot approval: A statistically based implementation
Author
Milne, Kurt A.
Author_Institution
Hewlett Packard Co., Ft. Collins, CO, USA
fYear
1993
fDate
17-21 Oct 1993
Firstpage
92
Lastpage
98
Abstract
A statistical process control (SPC) based tool for automated wafer lot approval has been developed and successfully implemented. This paper detail the prerequisites implemented prior to automated wafer lot approval, discuss the statistical methods and software implementation used to automate the disposition of each wafer, and present a study of that tool´s approval effectiveness on two products; one with low test yield variance and one with high test yield variance. Due to the mixed results of the initial implementation, additional methods of increasing the approval effectiveness are detailed
Keywords
automatic testing; integrated circuit testing; integrated circuit yield; production testing; statistical process control; SPC; automated wafer lot approval; statistical process control; test yield variance; Automatic testing; Data engineering; Databases; Error analysis; Error correction; Process control; Production; Standards development; Statistical analysis; Tires;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1993. Proceedings., International
Conference_Location
Baltimore, MD
Print_ISBN
0-7803-1430-1
Type
conf
DOI
10.1109/TEST.1993.470714
Filename
470714
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