DocumentCode :
1828978
Title :
Numerical simulations of forced convection in novel cylindrical oblique-finned heat sink
Author :
Fan, Yan ; Lee, Poh Seng ; Jin, Liwen ; Chua, Beng Wah
fYear :
2011
fDate :
7-9 Dec. 2011
Firstpage :
647
Lastpage :
652
Abstract :
In this paper, forced convection heat transfer of laminar flow through novel cylindrical discrete oblique fin heat sinks were simulated by Computational Fluid Dynamics method (CFD). The single channel structure was imported into FLUENT v.12.1 as a physical model to be simulated. The various aspect ratio and length ratios of discrete oblique fin arrays were investigated, and the optimized results were achieved. According to the results, the average Nusselt number for the copper heat sink could increase by as much as 73.5% and the average convective thermal resistance for the novel cylindrical micro-channel reduces by as much as 61.7% in comparison with the conventional micro-channel. The wall temperature and temperature gradient of cylindrical oblique fin heat sink are also much lower than those of conventional straight fin heat sink. It was concluded that the novel cylindrical microchannel heat sink is superior to conventional cylindrical microchannel heat sink. Lastly, the guidelines for optimizing cylindrical heat sink structure in different applications were also discussed.
Keywords :
computational fluid dynamics; flow simulation; forced convection; heat sinks; laminar flow; microchannel flow; thermal resistance; CFD; FLUENT v.12.1; Nusselt number; computational fluid dynamics; convective thermal resistance; cylindrical discrete oblique-finned heat sink; cylindrical microchannel heat sink; forced convection heat transfer; laminar flow; numerical simulations; temperature gradient; wall temperature; Fluids; Heat pumps; Heat sinks; Heat transfer; Mathematical model; Microchannel; Thermal resistance; Nusselt number; cylindrical heat sink; forced convection; oblique fin; thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
Type :
conf
DOI :
10.1109/EPTC.2011.6184499
Filename :
6184499
Link To Document :
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