Title :
A study of thermal effects in RF-MEM-switches using a time domain approach
Author :
Thiel, W. ; Tornquist, K. ; Reano, R. ; Katehi, L.P.B.
Author_Institution :
Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
A thermal analysis of RF-MEM-switches based on the heat conduction is presented. The heat equation Is solved by employing a Forward Time Centered Space (FTCS) difference scheme. For the electromagnetic (EM) characterization, the standard FDTD method is used which provides the dissipated RF power in the MEMS metal structure for a subsequent separate heat analysis. The computed temperature distribution In the switch was utilized as an input to a mechanical simulator for a mechanical analysis. This analysis has shown that when the MEMS switch operates under high power, a temperature gradient develops on the structure that strongly affects stress distribution on the switch. This stress redistribution impacts operation and affects switch lifetime. The accuracy of the presented method is demonstrated by comparing the theoretically computed and experimentally verified thermal profile of a patch antenna.
Keywords :
finite difference time-domain analysis; heat conduction; microactuators; semiconductor switches; temperature distribution; thermal analysis; FDTD method; RF-MEM-switches; electromagnetic characterization; forward time centered space difference scheme; heat conduction; heat equation; mechanical analysis; mechanical simulator; patch antenna; stress distribution; switch lifetime; temperature distribution; thermal analysis; thermal effects; time domain approach; Difference equations; Electromagnetic heating; Finite difference methods; Micromechanical devices; Radio frequency; Space heating; Switches; Temperature distribution; Thermal conductivity; Thermal stresses;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1011601
