DocumentCode :
1831150
Title :
Notice of Retraction
Parameter fitting and finite element simulation of metal rubber
Author :
Cheng-zhong Gu ; Lie Chen ; Xin-yue Wu
Author_Institution :
Power Eng. Coll., Naval Univ. of Eng., Wuhan, China
Volume :
2
fYear :
2010
fDate :
1-3 Aug. 2010
Abstract :
Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

The mechanical behavior of metal wire coil of rubber inside is very complex. This paper has obtained hysteresis loop of the metal rubber by experimental research, and verified that metal rubber has viscoelasticity at macro level. Firstly, based on experimental data, the expression of load and deformation is proved by using the least square method. And the dissipation factor is calculated of metal rubber; Secondly, this paper research the constitutive equation model of viscoelastic material, and select the Foam model which appropriate metal rubber, and fit the model parameters using finite element software Patran; Finally, the correctness of parameter fitting is testified through practical examples. Paper provides a new research method for Metal Rubber Researching, and has strong theoretical and practical value.
Keywords :
cooling; deformation; finite element analysis; foam rubber; least squares approximations; viscoelasticity; wires; constitutive equation model; deformation; dissipation factor; finite element software Patran; foam model; hysteresis loop; least square method; metal rubber; metal wire coil; parameter fitting; viscoelastic material; Adaptation model; Load modeling; Rubber; Thermodynamics; FEM; Metal Rubber; hysteresis loop; the least square method; viscoelasticity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-7479-0
Type :
conf
DOI :
10.1109/ICMEE.2010.5558440
Filename :
5558440
Link To Document :
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