Title :
IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203)
Abstract :
The following topics were dealt with: ASICs; packaging techniques; power convertors; spacecraft packaging; 3D packaging; CAD tools; MCMs; power hybrids; heat sinks; and power modules
Keywords :
application specific integrated circuits; hybrid integrated circuits; modules; multichip modules; packaging; power convertors; power electronics; reliability; space vehicle electronics; 3D packaging; ASICs; CAD tools; MCMs; heat sinks; packaging techniques; power convertors; power hybrids; power modules; spacecraft packaging;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722238
