Title :
A 3D electrothermal simulation tool for integrated power modules
Author :
Gillot, C. ; Schaeffer, C.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
More and more compact converters with high current rates are required. Thus, the switch functions are composed of semiconductor chips associated in parallel within power modules. A safe and reliable conception requires one to consider the electrical side of the module and its cooling at the same time. A 3D electrothermal simulation tool was developed. It solves the heat conduction equation in stationary condition, and the electrical linear system of the parallel association which takes into account the thermal behaviour of each chip. Thus, a whole power module including its cooling can be conceived. Electrical and thermal imbalances of the module can be studied
Keywords :
cooling; digital simulation; electronic engineering computing; heat conduction; modules; power convertors; power electronics; thermal analysis; 3D electrothermal simulation tool; cooling; electrical linear system; heat conduction equation; integrated power modules; power converters; stationary condition; switch functions; thermal behaviour; thermal imbalances; Cooling; Electrothermal effects; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Multichip modules; Temperature; Thermal conductivity; Thermal resistance; Threshold voltage;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722247
