Title :
Efficient methodologies to study the signal integrity of multi Gb/s interconnects and full system EMC
Author :
Scogna, A. Ciccomanici ; Johns, D.P.
Author_Institution :
CST of America Inc., Framingham, MA, USA
Abstract :
This paper presents modern simulation techniques for the signal integrity (SI) of high speed interconnects (HSI) and full system EMC analysis. Partial element equivalent circuit (PEEC) is effectively use for EM and SPICE simulation. Different test boards are studied and results are validated by comparing multiple numerical methods. Guidelines for a full channel analysis are also provided and system level EMC is also investigated by means of transmission line matrix (TLM) method.
Keywords :
SPICE; electromagnetic interference; equivalent circuits; integrated circuit interconnections; numerical analysis; printed circuits; transmission line matrix methods; EM simulation; PCB; SPICE simulation; channel analysis; full system EMC; high-speed interconnects; interconnects; numerical methods; partial element equivalent circuit; signal integrity; transmission line matrix method; Analytical models; Circuit simulation; Circuit testing; Electromagnetic compatibility; Equivalent circuits; Guidelines; Integrated circuit interconnections; SPICE; Signal analysis; Transmission line matrix methods;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284557
