DocumentCode
1832575
Title
Different physical effects in UDSM MOSFET for delay & power estimation: A review
Author
Singh, Ashish Kumar ; Samanta, Jagannath
Author_Institution
Dept. of ECE, Haldia Inst. of Technol., Haldia, India
fYear
2012
fDate
1-2 March 2012
Firstpage
1
Lastpage
5
Abstract
Short-channel effects play a major role for MOS scaling of gate length down and especially below 0.1μm or even less. In this paper, the detail review of different secondary effects and their solutions for delay & power estimation which are proposed by various researchers in the past decade are presented briefly. Different effects like Gate Direct Tunneling Current (GDTC), Gate-Induced Drain Leakage (GIDL), Band-to-Band Tunneling Currents (BTBT), Negative Bias Temperature Instability (NBTI), Polysilicon-Gate Depletion Effects, Velocity Saturation, Reverse Short Channel Effect (RSCE), Substrate Current Induced Body Effect (SCBE), STI Stress Effect and Bulk Charge Effect etc are clearly explained and also described their solution techniques basically in ultra deep submicron region of CMOS devices. Some simulation & experiments results are taken from different researchers which will be explained, how these effects are related to different MOS model parameters.
Keywords
CMOS integrated circuits; MOSFET; tunnelling; CMOS devices; MOS scaling; STI stress effect; UDSM MOSFET; band-to-band tunneling currents; bulk charge effect; delay; gate direct tunneling current; gate-induced drain leakage; negative bias temperature instability; physical effects; polysilicon-gate depletion effects; power estimation; reverse short channel effect; short-channel effects; substrate current induced body effect; ultra deep submicron region; velocity saturation; CMOS integrated circuits; Doping; Integrated circuit modeling; Logic gates; MOSFET circuits; Threshold voltage; Tunneling; CMOS; GIDL; RSCE; Short-channel effects; UDSM;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical, Electronics and Computer Science (SCEECS), 2012 IEEE Students' Conference on
Conference_Location
Bhopal
Print_ISBN
978-1-4673-1516-6
Type
conf
DOI
10.1109/SCEECS.2012.6184747
Filename
6184747
Link To Document