DocumentCode :
1832663
Title :
A decomposition based algorithm for the scheduling problem in wafer fabrication system
Author :
Hu, Hongtao ; Jiang, Zhibin ; Guo, Chengtao ; Liu, Ran
Author_Institution :
Dept. of Ind. Eng. & Logistics Manage., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2010
fDate :
7-10 Dec. 2010
Firstpage :
2066
Lastpage :
2070
Abstract :
A decomposition based scheduling strategy is proposed to cope with the complexity of wafer fabrication, such as multi-products, reentrant process flow and unrelated parallel machines. The strategy is composed of genetic algorithm and dynamic scheduling rules. First, bottlenecks are detected and classified based on the constraint weights which are decided by the sensitivity of the system performance to the machine´s fluctuant availability. Second, a dynamic work in process (WIP) control strategy is used to determine the dispatching order by adjusting the deviation of the WIP levels to avoid the process fluctuation caused by unpredictable events. Third, a hybrid genetic algorithm (GA) is used to optimize the dispatching route of the lots. Finally, a simulation platform is developed to validate the effectiveness of the proposed method.
Keywords :
dispatching; dynamic scheduling; genetic algorithms; semiconductor industry; work in progress; WIP control; decomposition based algorithm; dispatching order; dispatching route; dynamic scheduling; dynamic work-in-process control; genetic algorithm; machine fluctuant availability; multiproduct; parallel machine; process fluctuation; reentrant process flow; scheduling problem; wafer fabrication system; Biological cells; Dispatching; Fabrication; Gallium; Job shop scheduling; Workstations; WIP control; genetic algorithm; scheduling; semiconductor wafer fabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
Conference_Location :
Macao
ISSN :
2157-3611
Print_ISBN :
978-1-4244-8501-7
Electronic_ISBN :
2157-3611
Type :
conf
DOI :
10.1109/IEEM.2010.5674645
Filename :
5674645
Link To Document :
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