SAP-a program package for three-dimensional interconnect simulation

Author

Sabelka, R. ; Selberherr, S.

Author_Institution

Inst. for Microelectron., Vienna, Austria

fYear

1998

fDate

1-3 Jun 1998

Firstpage

250

Lastpage

252

Abstract

We introduce a set of simulation programs for two- and three-dimensional analysis of interconnect structures. The SAP (smart analysis programs) simulators are based on the finite element method and can be used for highly accurate capacitance extraction, resistance calculation, transient electric and coupled electro-thermal simulations. Furthermore, the program package includes two preprocessors that support a layer-based input language and an automatic grid generator. Two application examples are given

Keywords

capacitance; circuit simulation; electric resistance; finite element analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; program processors; software tools; 2D interconnect structure analysis; 3D interconnect simulation; 3D interconnect structure analysis; SAP program package; SAP simulators; automatic grid generator; capacitance extraction; coupled electro-thermal simulation; finite element method; layer-based input language; program package preprocessors; resistance calculation; simulation programs; smart analysis programs; transient electric simulation; Analytical models; Capacitance; Couplings; Data preprocessing; Electric resistance; Finite element methods; LAN interconnection; Mesh generation; Packaging; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-4285-2

Type

conf

DOI

10.1109/IITC.1998.704913

Filename

704913