A general framework for SPICE-TLM interconnection

Author

So, P.P.M. ; Hoefer, W.J.R.

Author_Institution

Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada

Volume

2

fYear

2002

fDate

2-7 June 2002

Firstpage

1123

Abstract

A general SPICE-TLM interconnection framework will be presented. The connection algorithm is based on the representation of the TLM network by equivalent Thevenin and/or Norton sources, The framework opens new and far-reaching possibilities for hybrid global microwave and high-speed digital circuit modeling in time domain because it integrates the extensive circuit and device models of SPICE into general three-dimensional field solutions in real time.

Keywords

SPICE; digital integrated circuits; microwave integrated circuits; time-domain analysis; transmission line matrix methods; SPICE-TLM interconnection framework; connection algorithm; distributed device embedding; equivalent Norton sources; equivalent Thevenin sources; high-speed digital circuit modeling; hybrid global microwave circuit modeling; lumped device embedding; three-dimensional field solutions; time domain modeling; Computational electromagnetics; Coupling circuits; Integrated circuit interconnections; Laboratories; Microwave circuits; Microwave devices; SPICE; Scattering; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1011845

Filename

1011845