DocumentCode
1835898
Title
Tailored modeling of microdevices and systems using thermodynamic methods
Author
Wachutka, Gerhard K.
Author_Institution
Tech. Univ. Munchen, Germany
fYear
1995
fDate
24-28 Oct 1995
Firstpage
613
Lastpage
615
Abstract
In the development and production of miniaturized electronic devices and transducers, computer simulations constitute a cost-effective and time-economizing alternative to the traditional experimental approach by “straightforward trial and error”. Application-oriented modeling not only helps the designer in understanding the “inner life” of the individual components and their cooperation in a circuit or microsystem, but it also assists him in making decisions with a view to finding optimized microstructures under technological and economical constraints. The ambitious long-term goal is the automated optimization of microsystems according to customer-supplied specifications in a computer-based “virtual factory” prior to the real fabrication. Currently several attempts are being made to build up a “CAD tool box” for top-down and closed-loop simulation of microsystems. Using the concept of “tailored modeling”, which is based on established thermodynamic methods, specific problems of microtransducer modeling such as the consistent formulation of transducer effects, the consistent treatment of coupled fields, and methodologies for fast and reliable model validation can be tackled in a practical way
Keywords
CAD; micromechanical devices; modelling; thermodynamics; transducers; CAD tool box; application-oriented modeling; automated optimization; computer simulation; design; electronic devices; microdevices; microsystems; tailored modeling; thermodynamic methods; transducers; virtual factory; Circuits; Computer errors; Computer simulation; Constraint optimization; Design optimization; Fabrication; Microstructure; Production; Thermodynamics; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.503368
Filename
503368
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