Title :
The MSM5100/sup TM/ cdma2000 + AMPS + gpsOne/sup TM/ + Bluetooth multimode ASIC for 3G handsets
Author :
Butler, B.K. ; King-Chung Lai ; Saints, K. ; Meagher, B.
Author_Institution :
CDMA Technol. group, QUALCOMM Inc., San Diego, CA, USA
Abstract :
The MSM5100 ASIC forms the heart of a high-featured cdma2000 3G handset that is gpsOne position location capable. The gpsOne technology meets the accuracy requirements set by the FCC for E911 Phase II. This ASIC performs baseband processing for the spectrum of air interfaces supported: IS-2000 Release 0, IS-95A/B, AMPS, GPS, and Bluetooth 1.1. The ASIC itself is both a merging effort of two previous ASIC designs, MSM3300 and MSM5000, and the addition of new functionality. The new functionality includes USB speed enhancements and increased IS-2000 physical layer support. Also, several new VLSI challenges were met in creating this product, including our product in the 0.18 um process and integrated voltage regulators. Altogether, the MSM5100 makes a significant leap forward in 3G handset functionality.
Keywords :
CMOS digital integrated circuits; Global Positioning System; application specific integrated circuits; ball grid arrays; cellular radio; code division multiple access; fine-pitch technology; integrated circuit packaging; modems; telephone sets; AMPS; Bluetooth 1.1; CDMA handset; E911 Phase II; IS-2000 Release 0; IS-95A/B; MSM5100 ASIC; USB design; baseband processing; cdma2000 3G handset; digital CMOS process; fine-pitch ball grid array; gpsOne position location capable; integrated mobile station modem; physical layer support; Application specific integrated circuits; Baseband; Bluetooth; FCC; Global Positioning System; Heart; Merging; Physical layer; Telephone sets; Universal Serial Bus;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7246-8
DOI :
10.1109/RFIC.2002.1012027
