Title :
Interconnect simulation using order reduction and scattering parameters
Author :
Beyene, Wendemagegnehu T. ; Schutt-Ainé, José E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
This paper demonstrates the use of scattering parameters for efficient and accurate simulation of transmission lines. First, a low-order rational approximation scheme is applied to the s parameters of the line system, next an appropriate reference system is chosen to optimize the formulation. Finally, the low-order rational approximations of the scattering parameters are directly implemented in conventional time-domain simulator using recursive convolution. Experimental results are used to validate the computer simulations
Keywords :
S-parameters; integrated circuit interconnections; integrated circuit modelling; reduced order systems; transmission line theory; computer simulation; interconnect; order reduction; rational approximation; recursive convolution; scattering parameters; time-domain simulator; transmission line; Computational modeling; Convolution; Differential equations; Frequency; Propagation losses; Scattering parameters; Time domain analysis; Transmission line matrix methods; Transmission line measurements; Transmission lines;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678761