Title :
Data mining and fault diagnosis based on wafer acceptance test data and in-line manufacturing data
Author :
Fan, Chih-Min ; Guo, Ruey-Shan ; Chen, Argon ; Hsu, Kuo-Ching ; Wei, Chih-Shih
Author_Institution :
R&D Div., Asiatek Inc, Taipei, Taiwan
Abstract :
This paper focuses on techniques for automatically extracting process knowledge from a production database for fault diagnosis and optimizing device performance with a fixed target. An integrated parametric analysis scheme is developed with supplemented graphical methods to facilitate interpretation of the results. It consists of five phases: device variation partition, key node screening, linear equipment modeling, graph aided interpretation, and control policy re-evaluation. The concepts of quality control, data mining, and process knowledge are integrated in this scheme. A field data case study shows that the integrated parametric analysis scheme is able to diagnose the parametric yield problem, help engineers construct the knowledge base, predict the yield, and provide insight for yield enhancement
Keywords :
data mining; electronic engineering computing; fault diagnosis; integrated circuit manufacture; integrated circuit testing; integrated circuit yield; manufacturing data processing; production engineering computing; production testing; quality control; automatic process knowledge extraction; control policy re-evaluation; data mining; device performance optimisation; device variation partition; fault diagnosis; graph aided interpretation; graphical methods; integrated parametric analysis scheme; key node screening; linear equipment modeling; parametric yield problem; production database; quality control; semiconductor manufacturing; yield enhancement; yield prediction; Data engineering; Data mining; Decision trees; Fault diagnosis; Manufacturing processes; Neural networks; Regression tree analysis; Semiconductor device manufacture; Statistical analysis; Testing;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962941