Title :
Control of edge polishing profile with air float carrier
Author :
Fujita, Takashi ; Touzov, Mikhail ; Michiya, Satomi ; Doy, T.K.
Author_Institution :
CMP Group, Tokyo Seimitsu Co. Ltd., Japan
Abstract :
An air float carrier is developed to achieve uniform polishing with continuous air supply during polishing of the wafer. The carrier has a thin support film inside the retainer ring. Retainer pressure enables the support film to push the wafer edge down to the pad locally to control edge-polishing profile. Using this air float carrier, we try to evaluate the relationship between pressure profile measured under static condition and actual edge-polishing profile at various retainer extensions and various retainer pressures. As a result of this comparison, it has become evident that the calculated pressure profile corresponds to the actual edge-polishing profile and retainer pressure has a great influence on the actual edge-polishing profile
Keywords :
chemical mechanical polishing; integrated circuit measurement; integrated circuit technology; integrated circuit yield; process control; air float carrier; continuous air supply; edge polishing profile; pressure profile; retainer extensions; retainer pressure; static condition; uniform polishing; wafer edge; Area measurement; Chemical processes; Continuing education; Finite element methods; Manufacturing processes; Pressure control; Pressure measurement; Semiconductor device manufacture; Semiconductor device modeling; Stress;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962944
