Title :
Development of a new solder joint modeling tool for IC package designers
Author :
Lewis, Daniel ; Warren, James ; Josell, Daniel
Author_Institution :
Lucent Technol., Allentown, PA, USA
Abstract :
In an attempt to assist IC package designers, a model for predicting solder meniscus geometries from lead shapes and material parameters is currently under development. Of particular interest, the gull-wing lead is mathematically represented as a horizontal section and two smoothly joined parabolas, allowing close matching of experimental gull-wing solder joints. Solutions are obtained using the public domain Surface Evolver software. This software was designed to solve problems pertaining to equilibrium meniscus geometry and includes routines for calculating wetting forces such as those exerted on component leads by molten solder. Meniscus geometry and force results from these calculations can be used in finite-element modeling programs to determine thermomechanical stresses
Keywords :
finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; soldering; thermal stresses; IC package design; Surface Evolver software; finite-element modeling programs; gull-wing lead; horizontal section; lead shapes; material parameters; meniscus geometries; modeling tool; smoothly joined parabolas; solder joint modeling; thermomechanical stresses; wetting forces; Geometry; Integrated circuit modeling; Integrated circuit packaging; Lead; Predictive models; Shape; Software design; Soldering; Solid modeling; Thermal force;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678781
