DocumentCode
1839261
Title
Design techniques for improved microwave performance of small outline packages
Author
Jessie, D. ; Larson, L.
Author_Institution
California Univ., San Diego, La Jolla, CA, USA
fYear
2002
fDate
3-4 June 2002
Firstpage
381
Lastpage
384
Abstract
General techniques to improve the microwave performance of plastic leaded packages have been developed. These techniques result in an Improvement of the bandwidth and reduction of losses in the structure. The techniques were applied to an SSOP8 configuration, and the useful frequency range was extended from 6 GHz to well above 10 GHz.
Keywords
integrated circuit packaging; microwave integrated circuits; plastic packaging; 6 to 15 GHz; SSOP8 configuration; X-band region; bandwidth Improvement; design techniques; high-frequency response; improved microwave performance; losses reduction; low-cost implementation; optimization; plastic leaded packages; small outline packages; Bonding; Coupling circuits; Frequency; Inductance; Microwave theory and techniques; Pins; Plastic integrated circuit packaging; Plastic packaging; Resonance; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE
Conference_Location
Seattle, WA, USA
ISSN
1529-2517
Print_ISBN
0-7803-7246-8
Type
conf
DOI
10.1109/RFIC.2002.1012072
Filename
1012072
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