DocumentCode
1840261
Title
ESD dynamic methodology for diagnosis and predictive simulation of HBM/CDM events
Author
Ku, Ting-Sheng ; Chen, Jau-Wen ; Kokai, George ; Chang, Norman ; Lin, Shen ; Liu, Yu ; Li, Ying-Shiun ; Hu, Bo
Author_Institution
Nvidia, Inc., Santa Clara, CA, USA
fYear
2012
fDate
9-14 Sept. 2012
Firstpage
1
Lastpage
9
Abstract
A comprehensive ESD dynamic methodology is developed for failure diagnosis and predictive simulation of improvements. This methodology focuses on dynamic analysis including modeling of die-level metal grid, substrate grid and well-diode, package effective capacitance, and pogo pin. Real HBM and CDM application examples are illustrated.
Keywords
capacitance; electronics packaging; electrostatic discharge; failure analysis; ESD dynamic methodology; HBM-CDM event predictive simulation; charge device model; die-level metal grid modeling; failure diagnosis; human metal model; package effective capacitance; pogo pin; substrate grid; well-diode; Clamps; Electrostatic discharges; Fingers; Junctions; Metals; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th
Conference_Location
Tucson, AZ
ISSN
0739-5159
Print_ISBN
978-1-4673-1467-1
Type
conf
Filename
6333288
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