DocumentCode :
1841097
Title :
Adhesives for optical devices
Author :
Murata, Norio
Author_Institution :
Adv. Technol. Corp., NTT, Tokyo, Japan
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
1178
Lastpage :
1185
Abstract :
Three types of UV-curable adhesives, a room temperature curing sealant and a hot-melt adhesive for the fabrication of optical communications devices were developed. (1) Using new epoxies, acrylates and vinyl sulfide containing fluorine, bromine and sulfur, the refractive indices of UV-curable transparent adhesives can be controlled, in the range 1.41-1.70 within ±0.005 with a high light transmittance of 80-90% at a wavelength of 1.3 μm. They possess an excellent refractive index matching that of optical glass and optical fibers. They have high adhesive strength and good durability. (2) The UV-curable precision adhesive has an extremely low volume shrinkage of 1.2% during curing and the cured adhesive has a low thermal expansion coefficient of <2×10-5/°C. Therefore, they can be used in the fabrication of optical devices that require sub-micron positioning accuracy. (3) The UV-curable thermal-resistant adhesive exhibits a high glass transition temperature of more than 200°C. This adhesive has applications in the assembly of optical components that require higher heat-resistance. (4) The water permeability of the moisture-protected adhesive sealant is an extremely small 8×10-9 cc cm/cm2/cmHg/sec at a high temperature of 75°C. The optical excess loss of sealing fiber due to the microbending during curing and temperature cycling (+85°C to -40°C) is negligibly small (less than 0.01 dB). (5) The water-resistant hot-melt adhesive for reinforcing optical-fiber splices applied to quartz glass by hot-press for 3 minutes at 130°C provides excellent adhesion. The peel strength is maintained for over one year after immersion in water of 60°C. These qualities of the developed UV-curable adhesives and the new sealants are advantageous for achieving low-cost and high reliability optical devices
Keywords :
adhesives; assembling; mechanical strength; optical communication equipment; optical fabrication; optical losses; refractive index; seals (stoppers); thermal expansion; 1.3 micrometre; 60 to 200 degC; UV-curable adhesives; UV-curable transparent adhesives; adhesive strength; assembly; curing sealant; durability; glass transition temperature; hot-melt adhesive; light transmittance; microbending; moisture-protected adhesive sealant; optical communications devices; optical excess loss; optical-fiber splices; peel strength; refractive index; reliability; sub-micron positioning accuracy; temperature cycling; thermal expansion coefficient; volume shrinkage; water permeability; Curing; Glass; Optical device fabrication; Optical devices; Optical fibers; Optical refraction; Optical variables control; Sealing materials; Temperature; Ultraviolet sources;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components &amp; Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678869
Filename :
678869
Link To Document :
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