STATPEP-current status of power electronic packaging for power supplies-methodology

The paper presents a methodology for a review of the current status of power electronic packaging (PEP) used in commercial switch mode power supplies. Based on the current status and the knowledge about the development of PEP over the last 5 to 10 years experience curves can be developed which will show the expected trends in PEP of power supplies for the future. The above mentioned experience curves are proposed as a prediction tool for the industry and Its suppliers and customers over the next 5 years. This project was initiated by the Power Sources Manufacturers Association (PSMA) to benefit the power sources industry