DocumentCode
1844191
Title
Nanofabrication of reactive structure for low temperature bonding
Author
Lin, Yu-Ching ; Bräuer, Jörg ; Hofmann, Lutz ; Baum, Mario ; Frömel, Jörg ; Wiemer, Maik ; Esashi, Masayoshi ; Gessner, Thomas
Author_Institution
WPI Adv. Inst. for Mater. Res., Tohoku Univ., Sendai, Japan
fYear
2009
fDate
18-21 Oct. 2009
Firstpage
313
Lastpage
317
Abstract
Microsystems that are used for medical application mostly consist of temperature sensible components. Therefore the temperatures during the fabrication process must be limited. This paper deals with the fabrication of reactive nanostructures that have the capability to be used as local heat source and thus can be used for processes during the fabrication of temperature sensible systems. Hereby, heat is produced during a self propagating exothermal reaction of two different materials that are present in a multilayered system of horizontal or vertical arranged material films in nanoscale dimensions. In this paper the principle of the self propagating reaction of those reactive systems as well as their fabrication is shown.
Keywords
integrated circuit bonding; nanofabrication; horizontal multilayered system; local heat source; low temperature bonding; microsystems; reactive structure nanofabrication process; self propagating exothermal reaction; temperature sensible system fabrication; vertical arranged material films; Bonding; Heating; Nanofabrication; nanofabrication; reactive multilayer; self-propagating exothermic reactions; silicon bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
Conference_Location
Tainan
Print_ISBN
978-1-4244-5528-7
Type
conf
DOI
10.1109/NANOMED.2009.5559063
Filename
5559063
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