• DocumentCode
    1844512
  • Title

    Thermal management using interleaved CVD diamond layers for high power 3D chip stacks

  • Author

    Ozguz, V. ; Albert, D. ; Camien, A. ; Ludwig, D. ; Patra, S.

  • Author_Institution
    Irvine Sensors Corp., Costa Mesa, CA, USA
  • fYear
    1998
  • fDate
    17-19 Sep 1998
  • Firstpage
    66
  • Lastpage
    67
  • Abstract
    The use of CVD diamond layers as a thermal management tool for the implementation of 3D stacks will allow up to 100 W power dissipation in 3D-MCM applications
  • Keywords
    CVD coatings; cooling; diamond; integrated circuit packaging; multichip modules; 100 W; 3D-MCM applications; C; high power 3D chip stacks; interleaved CVD diamond layers; power dissipation; thermal management; Electronic packaging thermal management; Energy management; Heat sinks; Power system management; Silicon; Stacking; Temperature; Testing; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-5033-2
  • Type

    conf

  • DOI
    10.1109/IWIPP.1998.722309
  • Filename
    722309
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1844512