Wireless communications using integrated antennas

Author

O, K.K. ; Kim, K. ; Floyd, B. ; Mehta, J. ; Yoon, H. ; Hung, C.-M. ; Bravo, D. ; Dickson, T. ; Guo, X. ; Li, R. ; Trichy, N. ; Caserta, J. ; Bomstad, W. ; Branch, J. ; Yang, D.-J. ; Bohorquez, J. ; Gao, L. ; Sugavanam, A. ; Lin, J.-J. ; Chen, J. ; Martin,

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA

fYear

2003

fDate

2-4 June 2003

Firstpage

111

Lastpage

113

Abstract

The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction between transmitted and received signals and nearby circuits appear to be manageable. This technology can potentially be applied for implementation of a true single chip radio, on-chip and inter-chip communication systems, RFID tags, and others.

Keywords

CMOS digital integrated circuits; dipole antennas; integrated circuit interconnections; integrated circuit packaging; loop antennas; monolithic integrated circuits; radiocommunication; radiowave propagation; RFID tags; foundry digital CMOS technology; heat removal; integrated antennas; integrated circuits; inter-chip communication; metal structures; on-chip communication; packaging; single chip radio; transmitted signal-received signal interaction; wireless communications; wireless interconnects; CMOS digital integrated circuits; CMOS technology; Clocks; Dipole antennas; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Silicon; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International

Print_ISBN

0-7803-7797-4

Type

conf

DOI

10.1109/IITC.2003.1219727

Filename

1219727