• DocumentCode
    1845565
  • Title

    To determine the adhesion by using AFM and the adhesive material volume estimation

  • Author

    Chen, K.Y. ; Yeh, Y.L. ; Wang, C.C. ; Jang, M.J. ; Lee, C.W.

  • Author_Institution
    Dept. of Mech. Eng., Far East Univ., Tainan, Taiwan
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    The paper studies the effect of the adhesive mass in the cantilever beam dynamic. In this paper, this determines the adhesive mass by using the adhesive material volume. The adhesive volume estimation is the semi-sphere volume. The adhesive volume in the cantilever beam can be determined by using the SEM (Scanning Electron Microscopy, SEM). From the analysis result, this can be found that the effect of the moisture in the cantilever beam resonance is very clear. These determined materials are four material included Mg, Cu, Fe and Ti. These analyzed result show that the determined adhesive mass error between the semi-sphere volume method and the resonance method is smaller 15.99% in these four materials. The adhesive mass big error shows in the handling material. This can know that the result by using the semi-sphere volume method is very closed the theoretical value by using the cantilever beam resonance.
  • Keywords
    adhesion; adhesives; atomic force microscopy; beams (structures); cantilevers; copper; iron; magnesium; scanning electron microscopy; titanium; AFM; Cu; Fe; Mg; Ti; adhesion; adhesive mass; adhesive mass big error; adhesive mass error; adhesive material volume estimation; adhesive volume; cantilever beam dynamic; cantilever beam resonance; handling material; scanning electron microscopy; semisphere volume; semisphere volume method; Copper; Iron; Silicon; Structural beams; Testing; AFM; adhesive;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-5528-7
  • Type

    conf

  • DOI
    10.1109/NANOMED.2009.5559125
  • Filename
    5559125