DocumentCode :
1845879
Title :
Measuring interface thermal resistance values by transient testing
Author :
Rencz, Marta ; Székely, Vladimir ; Farkas, Gabor ; Courtois, Bernard
Author_Institution :
Micred Ltd., Budapest, Hungary
fYear :
2002
fDate :
2002
Firstpage :
136
Lastpage :
141
Abstract :
A method is presented for detecting increased thermal resistance values within a heat conduction path with the help of transient thermal measurements. After summarizing the theoretical background of structure function evaluation it is demonstrated how to determine partial thermal resistances in the cases when one dimensional heat flow may be assumed. The paper presents a typical structure developed to measure small thermal resistance values with the help of the presented method. Simulated results demonstrate the feasibility of the suggested method, and measured examples demonstrate the applicability.
Keywords :
heat sinks; packaging; thermal resistance; transient analysis; heat conduction path; interface thermal resistance value measurement; one dimensional heat flow; package; partial thermal- resistances; structure function evaluation; transient testing; Area measurement; Capacitance measurement; Conductivity measurement; Density measurement; Electrical resistance measurement; Resistance heating; Testing; Thermal conductivity; Thermal resistance; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012449
Filename :
1012449
Link To Document :
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