Title :
A novel memory architecture for multicore SDR systems
Author :
Cheng, Wei-min ; Yao-Hua Chen ; Pei-Wei Hsu ; Chun-Fan Wei ; Chia-Pin Chen ; Hsun-Lun Huang
Author_Institution :
Inf. & Commun. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
For conventional wireless transceiver architectures with software-defined radio (SDR) technology, the communication between microcontrollers, DSPs (digital signal processors), and memories are through public shared buses. As wireless standards change frequently, the demands of bus bandwidth increase. To avoid bus bottlenecks and to get better performance, the wireless transceiver architectures with concatenate memories and concatenate buses are proposed. The application-specific instruction-set processor (ASIP) for the IEEE 802.11p standard and the electronic system-level (ESL) virtual platform for the inner receiver of IEEE 802.11p are built. Via the proposed transceiver architectures with concatenate memories and concatenate buses, the bandwidth of communication between DSPs through public shared buses can be saved because the communications between DSPs and concatenate memories are through concatenate buses.
Keywords :
digital signal processing chips; field buses; instruction sets; microcontrollers; radio transceivers; shared memory systems; software radio; telecommunication standards; ASIP; DSP; ESL; IEEE 802.11p standard; application-specific instruction-set processor; bus bottleneck avoidance; concatenate bus bandwidth; concatenate memory architecture; digital signal processor; electronic system-level virtual platform; microcontroller; multicore SDR system; public shared bus; software-defined radio technology; wireless standard; wireless transceiver architecture; IEEE 802.11p; application-specific instruction-set processor (ASIP); electronic system-level (ESL); software-defined radio (SDR); wireless communications; wireless local area network (WLAN);
Conference_Titel :
Signal Processing (ICSP), 2012 IEEE 11th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-2196-9
DOI :
10.1109/ICoSP.2012.6491685