A new approach to the design of complex heat transfer systems: notebook-size computer design

Author

Nakanishi, M. ; Nakayama, W. ; Behnia, M. ; Soodphakdee, D.

Author_Institution

Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan

fYear

2002

fDate

2002

Firstpage

595

Lastpage

599

Abstract

A new approach for solving heat-transfer problems in geometrically complex systems has been developed. The purpose of this new approach is to develop a methodology whereby the packaging designers is freed from the task of performing detailed numerical analysis. The approach utilizes templates of components and electric devices rather than working on actual components, without simulation of the detailed complex geometry. By varying the template dimensions, the effects of geometrical configurations on cooling airflow and heat-transfer can be studied systematically. The approach is applicable to heat-transfer analysis of portable computers. Available numerical analysis tools, such as computational fluid dynamics (CFD) codes, are used to create heat-transfer databases from which fast design codes can be developed.

Keywords

computational fluid dynamics; cooling; notebook computers; thermal management (packaging); air flow; component template; computational fluid dynamics model; computer database; design productivity; electrical device; electronic cooling; heat transfer; notebook computer; numerical simulation; packaging technology; portable computer; thermal management; Computational fluid dynamics; Computational modeling; Cooling; Geometry; Heat transfer; Numerical analysis; Packaging; Portable computers; Solid modeling; Spatial databases;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on

ISSN

1089-9870

Print_ISBN

0-7803-7152-6

Type

conf

DOI

10.1109/ITHERM.2002.1012508

Filename

1012508