Title :
Development of Vertical Interconnects for Mixed Substrate Technology
Author :
Pham, A. ; Sutono, A. ; Laskar, J. ; Krishnamurthy, V. ; Lester, D. ; Balch, E. ; Rose, J.
Author_Institution :
Clemson University, Department of Electrical and Computer Engineering, Riggs Hall PO BOX 340915, Clemson, SC 29634-0915 Email: anh-vu.pham@ces.clemson.edu
Abstract :
We present the design and development of a vertical interconnect for both multi-chip modules and print circuit board technologies at microwave frequencies. This vertical feed-through provides the electrical interconnects from the first to the second level packaging to allow the use of multiple board technologies for a system. The experimental results demonstrate that the vertical interconnect has ultra-low parasitic and achieves a return loss of greater than 20-dB at 4-GHz.
Keywords :
Coplanar waveguides; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microwave frequencies; Microwave technology; Optical materials; Plastics; Substrates; Testing;
Conference_Titel :
ARFTG Conference Digest-Spring, 54th
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1999.327373
