DocumentCode :
1850646
Title :
Integration of tunable capacitors and bonded-wires for contactless RF switch and tunable filter
Author :
Chen, Shih-Jui ; Lee, Chuang-Yuan ; Kim, Eun Sok
Author_Institution :
Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
545
Lastpage :
548
Abstract :
This paper describes a contactless RF MEMS switch, composed of two surface-micromachined tunable capacitors and two bonded-wire inductors, which can achieve a power isolation ratio of 10 dB with a capacitance variation of mere 4:1 over a narrow bandwidth near 2.4 GHz. This novel approach of using inductors eases the deflection requirement for the deformable bridge for the variable capacitor, and allows piezoelectric ZnO film to be used to deflect the capacitor bridge to vary the air gap, thus yielding a contactless RF switch.
Keywords :
capacitors; circuit tuning; crystal filters; micromachining; microswitches; piezoelectric thin films; radiofrequency filters; wide band gap semiconductors; wires; zinc compounds; ZnO; bonded wires; contactless RF switch; deformable bridge; piezoelectric film; surface-micromachined tunable capacitors; tunable filter; Bandwidth; Bonding; Bridge circuits; Capacitance; Capacitors; Contacts; Filters; Radio frequency; Radiofrequency microelectromechanical systems; Switches; RF MEMS switch; tunable capacitor; tunable filter; wire-bond inductor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285382
Filename :
5285382
Link To Document :
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