Title :
A hybrid PMCHWT and VIE formulation for the calculation of EM scattering from electric and magnetic materials
Author :
Chong Luo ; Caicheng Lu
Author_Institution :
Dept. of Electr. & Comput. Eng., Kentucky Univ., Lexington, KY, USA
Abstract :
Summary form only given. The surface integral equation formulation is applicable to homogeneous material only. If there is a slight change of dielectric contrast within the volume, or there is a small portion of the material region that has inhomogeneous permittivity, the SIE will no longer be valid. It has been proposed that an additional volume integral equation be introduced to model the inhomogeneous part of the material region. The idea is to use the induced volume current for the region that has dielectric contrast which is different from the majority of the dielectric region. This is called the hybrid PMCHWT and VIE formulation. In this presentation, we apply this method to calculate the scattering by three-dimensional material scatterers. Our formulation uses the quadrilateral mesh for the surface modeling and hexahedron mesh for the volume modeling. Methods to treat the singular integrals for various integral operators are discussed, and validation numerical results will be shown.
Keywords :
computational electromagnetics; dielectric bodies; electric field integral equations; electromagnetic wave scattering; magnetic field integral equations; matrix decomposition; mesh generation; method of moments; permittivity; PMCHWT formulation; dielectric contrast; dielectric material; electromagnetic scattering; hexahedron mesh; hybrid formulation; induced volume current; inhomogeneous permittivity; magnetic material; matrix equation system; quadrilateral mesh; singular integrals; surface integral equation; surface modeling; three-dimensional scatterers; volume integral equation; volume modeling; Antennas and propagation; Dielectric losses; Dielectric materials; Electromagnetic propagation; Electromagnetic scattering; Integral equations; Magnetic materials; Surface treatment;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1220133