Title :
A MEMS sensor for mean shear stress measurements in high-speed turbulent flows with backside interconnects
Author :
Grady, A.O. ; Larger, R. ; Tiliakos, N. ; Papadopoulos, G. ; Modi, V. ; Fréchette, L.G.
Author_Institution :
Mech. Eng. Dept., Columbia Univ., New York, NY, USA
Abstract :
A floating-element capacitive MEMS shear stress flow sensor was fabricated and shown to successfully measure mean-turbulent skin friction in high-speed compressible duct flow. The sensor was designed for harsh environments (e.g. high-temperature, high-shear stress) with novel through-substrate interconnects for robust packaging and remote circuitry for capacitance measurement. This paper extends our previous work on the MEMS shear stress sensor design and backside interconnect process development to provide complete device fabrication and testing in a high-speed flow.
Keywords :
capacitance measurement; microsensors; stress measurement; turbulence; MEMS sensor; MEMS shear stress sensor design; backside interconnect process development; capacitance measurement; device fabrication; device testing; floating-element capacitive MEMS shear stress flow sensor; harsh environment; high-speed compressible duct flow; high-speed turbulent flow; mean shear stress measurement; mean-turbulent skin friction; robust packaging; through-substrate interconnect; Capacitive sensors; Ducts; Fluid flow measurement; Friction; Integrated circuit interconnections; Micromechanical devices; Packaging; Robustness; Skin; Stress measurement; Capacitive Sensing; MEMS; Shear Stress; Skin Friction; Through Silicon Vias (TSV); Turbulence;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285510
