DocumentCode
1854428
Title
Optimization of inlets and outlets of an ALD chamber with radiant heating
Author
Jiang Huawei ; Zhou Tao ; Liu Xiao ; Bin Shan ; Rong Chen
Author_Institution
State Key Lab. of Mater. Process. & Die & Mould Technol. & Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2013
fDate
July 30 2013-Aug. 2 2013
Firstpage
170
Lastpage
175
Abstract
A chemical reaction chamber was designed and manufactured to grow high quality, ultra-thin films using the atomic layer deposition (ALD) technology. As the distribution of temperature and gas pressure has large influences on the thickness of sub-nanometer films, it is crucial to achieve uniformity in terms of temperature and gas flow on the substrate. We report here the design and optimization of a cross-flow structured and radiation heated chamber, with special focus on the multi-inlet and multi-outlet structures to deliver the precursors and to get better distribution uniformity. Simulations based on finite element method (FEM) are employed to optimize the structure and corresponding experiments are made to validate with the simulation results.We find that by adjusting the inlet and outlet parameters, such as the inlet numbers and diameter, it is possible to achieve better uniformity of pressure on the substrate and a narrower film thickness distribution within the chamber. Factors influencing the gas flow over the wafer surface are reported and discussed.
Keywords
atomic layer deposition; chemical reactors; design engineering; finite element analysis; heat radiation; optimisation; temperature distribution; thermal management (packaging); ALD chamber; ALD technology; FEM; atomic layer deposition technology; chemical reaction chamber; design; finite element method; gas flow; gas pressure distribution; heat radiation; optimization; radiant heating; subnanometer films; temperature distribution; temperature flow; Force; Nonlinear dynamical systems; Resonant frequency; Rolling bearings; Shafts; Time-frequency analysis; Vibrations; atomic layer deposition (ALD); chamber; finite element method(FEM); simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Assembly and Manufacturing (ISAM), 2013 IEEE International Symposium on
Conference_Location
Xi´an
Print_ISBN
978-1-4799-1656-6
Type
conf
DOI
10.1109/ISAM.2013.6643519
Filename
6643519
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