• DocumentCode
    1856491
  • Title

    Direct pick, break, and placement of nanostructures and their integration with MEMS

  • Author

    Sosnowchik, Brian D. ; Chang, Jiyoung ; Lin, Liwei

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California at Berkeley, Berkeley, CA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    2168
  • Lastpage
    2171
  • Abstract
    A direct, simple, and versatile assembly method for the manipulation of one-dimensional nanostructures and their integration with MEMS has been demonstrated. Using common MEMS equipment - an optical microscope and an unbiased tungsten probe - the facile process has been employed to accurately manipulate titanium dioxide nanoswords and zinc oxide nanowires under a room-temperature, dry environment. The surface morphology of the nanostructures, probe tips, and adhesion forces were characterized. Using this process, a nanosword was integrated with a MEMS device to characterize its sensitivity to ultraviolet light. As such, the technique could enable the rapid assembly of individual nanostructures with CMOS-compatible devices.
  • Keywords
    II-VI semiconductors; adhesion; micromechanical devices; nanowires; optical microscopy; semiconductor quantum wires; surface morphology; titanium compounds; zinc compounds; CMOS-compatible devices; MEMS; TiO2; ZnO; adhesion forces; dry environment; one dimensional nanostructures; optical microscope; surface morphology; temperature 293 K to 298 K; titanium dioxide nanoswords; ultraviolet light; unbiased tungsten probe; versatile assembly method; zinc oxide nanowires; Assembly; Micromechanical devices; Nanostructures; Nanowires; Optical microscopy; Optical sensors; Probes; Titanium; Tungsten; Zinc oxide; Nanostructure Integration Pick and Place; Nanostructure Manipulation; TiO2 Nanoswords; ZnO Nanowires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285606
  • Filename
    5285606