Title :
Room-temperature wafer-level hermetic sealing for liquid reservoirs by gold ring embossing
Author :
Lapisa, M.A. ; Niklaus, F. ; Stemme, G.
Author_Institution :
KTH, R. Inst. of Technol., Stockholm, Sweden
Abstract :
In this paper, we present a novel room temperature wafer-level sealing process for hermetic sealing of reservoirs filled with liquids. This technique can be used for e.g. drug delivery devices or thermo pneumatic devices. The sealing mechanism is based on plastic deformation of metal squeeze rings and embossing of target structures. Epoxy based underfill is used for mechanical stabilization of the wafer bond. We present experimental results from room-temperature bonding of glass wafers to silicon wafers with encapsulation of liquids in reservoirs.
Keywords :
biomedical equipment; encapsulation; hermetic seals; plastic deformation; sealing materials; drug delivery devices; encapsulation; epoxy based underfill; glass wafers; gold ring embossing; liquid reservoirs; mechanical stabilization; metal squeeze rings; plastic deformation; room-temperature wafer-level hermetic sealing; silicon wafers; temperature 293 K to 298 K; thermo pneumatic devices; wafer bond; Drug delivery; Embossing; Glass; Gold; Liquids; Plastics; Reservoirs; Silicon; Temperature; Wafer bonding; Room-temperature sealing; hermetic reservoir; liquid encapsulation; wafer-level hermetic sealing;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285763
