DocumentCode :
1863425
Title :
Recycling of waste cured epoxy molding compound as a filler in poly (vinyl chloride) composites
Author :
Xu, W.J. ; Lu, S.Y.
Author_Institution :
Dept. of Environ. Sci. & Eng., Donghua Univ., Shanghai, China
fYear :
2010
fDate :
1-3 Aug. 2010
Firstpage :
24
Lastpage :
29
Abstract :
Pulverized mold residue of cured epoxy molding compound was reused to produce poly (vinyl chloride) composites with the aim to recycle resources in a more profitable and environmental concern way. The mold residue powder with functional groups on the surface was reactive to polar resins as the results of FT-IR spectrum (FT-IR). Mechanical tests, differential scanning calorimetry (DSC), vicat softening point test (VST) and scanning electron microscopy (SEM) were used to study effects of the adding content of the mold residue powder and molding parameters on properties of the PVC composites. The results showed that when molding pressure was fixed at 15 MPa, the optimum molding temperature and molding time were 200°C and 10 min, respectively. The maximum adding content of the powder was up to 70 wt%. When the mold residue powder content was 60 wt%, the PVC composites molded under optimum conditions showed excellent mechanical properties, with tensile strength of 30.33 MPa, flexural strength of 60.74 MPa and flexural modulus of 6.2 GPa. The DSC and VST test showed that the presence of the mold residue powder improved the heat resistance of the PVC composites. All the above results indicated that the reuse of mold residue powder as a filler in the PVC composites represented a promising way to recycle resources and resolve the environmental pollution problems.
Keywords :
curing; differential scanning calorimetry; environmental factors; filled polymers; mechanical testing; moulding; recycling; resins; scanning electron microscopy; tensile strength; FT-IR spectrum; PVC composite; differential scanning calorimetry; environmental pollution; filler; flexural modulus; flexural strength; mechanical property; mechanical test; mold residue powder; molding parameter; molding pressure; polar resin; polyvinyl chloride composite; pressure 15 MPa; pulverized mold residue; recycling; scanning electron microscopy; temperature 200 C; tensile strength; time 10 min; vicat softening point test; waste cured epoxy molding compound; Electromagnetic compatibility; Mechanical factors; Powders; Resins; Silicon compounds; Surface treatment; Temperature; Epoxy molding compound; mechanical property; mold residue; molding parameters; poly (vinyl chloride) composites; reuse;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Chemistry and Chemical Engineering (ICCCE), 2010 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-7765-4
Electronic_ISBN :
978-1-4244-7766-1
Type :
conf
DOI :
10.1109/ICCCENG.2010.5560353
Filename :
5560353
Link To Document :
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