DocumentCode
1864086
Title
A novel thermo-pneumatic peristaltic micropump with low temperature elevation
Author
Chia, Bonnie Tingting ; Liao, Hsin-Hung ; Yang, Yao-Joe
Author_Institution
Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2009
fDate
21-25 June 2009
Firstpage
2286
Lastpage
2289
Abstract
In this work, the development of a novel thermo-pneumatic peristaltic micropump, which consists of two separate zones for air-heating and fluid-squeezing, is presented. The device is realized by using micromachining techniques, and operated with simple actuation sequences. With a 5 V applied voltage and 40% heating duty ratio, maximum temperature elevation measured on the pumping diaphragm above the fluid-squeezing zone is 2.9 K, while a maximum value of 68.8 K is measured above the air-heating zone. Since significant reduction of temperature elevation on the working fluid is achieved, the device is suitable for the applications such as DNA chips or protein chips. Furthermore, applying higher voltage generates larger flow rate accompanied with relatively small increase of temperature elevation.
Keywords
diaphragms; micromachining; micropumps; temperature measurement; DNA chip applications; air-heating; fluid-squeezing; micromachining techniques; protein chip applications; pumping diaphragm; temperature 2.9 K; temperature 68.8 K; temperature elevation; thermo-pneumatic peristaltic micropump; voltage 5 V; Glass; Heat pumps; Mechanical engineering; Microchannel; Microfluidics; Micropumps; Semiconductor device measurement; Sequences; Temperature measurement; Voltage; PDMS; Thermo-pneumatic; microfluidic devices; micropump; peristaltic;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285892
Filename
5285892
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