• DocumentCode
    1864086
  • Title

    A novel thermo-pneumatic peristaltic micropump with low temperature elevation

  • Author

    Chia, Bonnie Tingting ; Liao, Hsin-Hung ; Yang, Yao-Joe

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    2286
  • Lastpage
    2289
  • Abstract
    In this work, the development of a novel thermo-pneumatic peristaltic micropump, which consists of two separate zones for air-heating and fluid-squeezing, is presented. The device is realized by using micromachining techniques, and operated with simple actuation sequences. With a 5 V applied voltage and 40% heating duty ratio, maximum temperature elevation measured on the pumping diaphragm above the fluid-squeezing zone is 2.9 K, while a maximum value of 68.8 K is measured above the air-heating zone. Since significant reduction of temperature elevation on the working fluid is achieved, the device is suitable for the applications such as DNA chips or protein chips. Furthermore, applying higher voltage generates larger flow rate accompanied with relatively small increase of temperature elevation.
  • Keywords
    diaphragms; micromachining; micropumps; temperature measurement; DNA chip applications; air-heating; fluid-squeezing; micromachining techniques; protein chip applications; pumping diaphragm; temperature 2.9 K; temperature 68.8 K; temperature elevation; thermo-pneumatic peristaltic micropump; voltage 5 V; Glass; Heat pumps; Mechanical engineering; Microchannel; Microfluidics; Micropumps; Semiconductor device measurement; Sequences; Temperature measurement; Voltage; PDMS; Thermo-pneumatic; microfluidic devices; micropump; peristaltic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285892
  • Filename
    5285892